includes cables, printed circuit boards, chassis, racks and more.
has years of electronic engineering experience in electronic packaging
including the electronic circuits contained inside.Our product design
engineering experience ranges
off the shelf containers to proprietary new designs for specific
needs. In our world of ever shrinking size requirements of today’s
electronics, Technisys has learned to pack generous amounts
of power and components into small spaces, saving valuable rack space
Whether developing a new package or modifying an existing design, attention
to detail is crucial. Consideration for heat dissipation and air flow
in active units are critical for assuring a reliable electronic product
and at Technisys we know this.
We also know how to solve heat dissipation
by proper ventilation control starting at the board level and carrying
through to the complete chassis enclosure. It could be solid state
cooling, special heat conductive materials or forced air using fans
but it will be studied and accommodated for success.